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Vacuum chucking plate made of porous ceramics

Chucking plates for substrates and thin films, utilizing properties of porous ceramics.

With semiconductor & electric device becoming more dense, thinner and smaller, this is the optimum vacuum chucking plate capable of fixing thin substrate and film evenly without making any dent.
Please contact us for more details.

Bonding technology for porous ceramics + dense ceramics

Chucking plates


  • Great progress in bonding accuracy stability reducing aged deterioration and temperature change.
  • With the issue of gap in bonding boundary surface fixed by special inorganic bonding, no dent observed while chucking & pressurization.
  • flatness: 3μm(size Φ300)
  • lightweight, high rigidity

bonded portion

bonded portion (SEM photo voltage: 15kV
magnification: ×35)

  • dicing machine
  • back-grinding process
  • optical inspection equipment
  • coater
  • high temperature test equipment
  • heating equipment

*Standard porous diameter: 60μm
Materials with other porous diameter (10〜580μm) are also available.

Large size chucking plate

the largest so far: 950×760×20t(Porous portions are split.)

Partial chucking

  • Optimum for LCD manufacturing process
  • rubbing equipment, scrubber, conveying equipment, etc.

Partial chucking【AH vacuum chucking plate】

Partial chucking

  • Capable of chucking a work (object chucked) having different shape from the chucking plate made of specific porous ceramics (M-AH). (partial chucking)
  • Lightweight by frameless single-piece construction
    flatness: 5μm

Flexible applications switch such as a 12-inch chucking plate capable of chucking both 12-inch work and 8-inch work.

We, Ariake Materials Co., Ltd., have integrated production line from raw materials to final machining process. Optional features, etc. are available.